Commit 7373cd4
thermal: intel: x86_pkg_temp_thermal: Fix bogus trip temperature
BugLink: https://bugs.launchpad.net/bugs/2115678
commit cf948c8e274e8b406e846cdf6cc48fe47f98cf57 upstream.
The tj_max value obtained from the Intel TCC library are in Celsius,
whereas the thermal subsystem operates in milli-Celsius.
This discrepancy leads to incorrect trip temperature calculations.
Fix bogus trip temperature by converting tj_max to milli-Celsius Unit.
Fixes: 8ef0ca4 ("Merge back other thermal control material for 6.3.")
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reported-by: zhang ning <zhangn1985@outlook.com>
Closes: https://lore.kernel.org/all/TY2PR01MB3786EF0FE24353026293F5ACCD97A@TY2PR01MB3786.jpnprd01.prod.outlook.com/
Tested-by: zhang ning <zhangn1985@outlook.com>
Cc: 6.3+ <stable@vger.kernel.org> # 6.3+
Link: https://patch.msgid.link/20250519070901.1031233-1-rui.zhang@intel.com
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Signed-off-by: Manuel Diewald <manuel.diewald@canonical.com>
Signed-off-by: Mehmet Basaran <mehmet.basaran@canonical.com>1 parent 6933776 commit 7373cd4
1 file changed
+1
-0
lines changed| Original file line number | Diff line number | Diff line change | |
|---|---|---|---|
| |||
329 | 329 | | |
330 | 330 | | |
331 | 331 | | |
| 332 | + | |
332 | 333 | | |
333 | 334 | | |
334 | 335 | | |
| |||
0 commit comments