Enable Remote proc cooling support #473
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Add a new generic driver for thermal cooling devices that control remote processors (modem, DSP, etc.) through various communication channels. This driver provides an abstraction layer between the thermal subsystem and vendor-specific remote processor communication mechanisms. Suggested-by: Amit Kucheria <amit.kucheria@oss.qualcomm.com> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251223123227.1317244-2-gaurav.kohli@oss.qualcomm.com
The cooling subnode of a remoteproc represents a client of the Thermal Mitigation Device QMI service running on it. Each subnode of the cooling node represents a single control exposed by the service. Add maintainer name also and update this binding for cdsp substem. Co-developed-by: Casey Connolly <casey.connolly@linaro.org> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Signed-off-by: Casey Connolly <casey.connolly@linaro.org> Link: https://lore.kernel.org/r/20251223123227.1317244-4-gaurav.kohli@oss.qualcomm.com
The Thermal Mitigation Device (TMD) service exposes various platform specific thermal mitigations available on remote subsystems (ie the modem and cdsp). The service is exposed via the QMI messaging interface, usually over the QRTR transport. Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions across multiple remote subsystems. These devices operate based on junction temperature sensors (TSENS) associated with thermal zones for each subsystem. Co-developed-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Signed-off-by: Casey Connolly <casey.connolly@linaro.org> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251223123227.1317244-5-gaurav.kohli@oss.qualcomm.com
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Enable Remote proc cooling support
CRs-Fixed: 3719815